Electrothermal Signoff for 2.5D and 3D-IC Systems
19.03.2021 · ANSYS ·
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This webinar showcases tools, such as Ansys RedHawk-SC Electrothermal, and techniques for modeling multi-die systems, like HBM and PCIE interfaces with silicon interposers, through-silicon vias (TSVs) and microbumps.
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