Reliability Anaysis of PCBs with Ansys HFSS, Icepak, Mechanical and Sherlock

When evaluating printed circuit board designs, engineers are faced with the challenge of balancing three broad areas of product reliability – electrical, thermal and mechanical reliability. This presentation outlines a workflow between Ansys Sherlock, Ansys Icepak, Ansys SIwave and Ansys Mechanical that combines simulations with reliability physics principles to evaluate and mitigate potential failure risks early in the design phase. Interested in learning more? Request a demo: https://www.ansys.com/products/electronics/electronics-reliability-demo