Ansys Sherlock and Ansys Icepak for Temperature Cycling

This presentation demonstrates an automated process for thermal modeling of printed circuit boards, including a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis. Interested in learning more? Request a demo: https://www.ansys.com/products/electronics/electronics-reliability-demo