Reliability in a Connected World: Integrating Ansys Mechanical and Sherlock

Printed Circuit Boards (PCBs) are complex structures from both geometric and material viewpoints and are often simulated (and tested) under a variety of demanding environmental conditions (shock, vibration, drop, etc.). In this presentation, we will discuss the range of techniques available in the Ansys portfolio for addressing challenges that accompany PCB modeling. Specifically, we will discuss homogenization, trace mapping, reinforcement elements (workflow new at Ansys 2020 R2), and trace modeling. We will also discuss the approaches available in Ansys Sherlock, SpaceClaim, and Mechanical for modeling solder, component geometry and chassis structures for a wide-variety of mechanical simulations. Interested in learning more? Request a demo: https://www.ansys.com/products/electronics/electronics-reliability-demo