Semiconductor Packaging Performance – High-Tech Industry Process Experience

The Semiconductor Packaging Simulation solution reduces the need for fabricating test prototypes by substituting virtual testing and lifecycle prediction. Modern progressive fracture/failure capabilities, best-in-class solver performance and interactive programming capabilities enable efficient model generation and preparation. Supported simulation methods enable robust coupled-field analysis of thermal, electrical, mechanical and moisture-sensitivity load regimes. Engineers are able to predict complex real-world behavior with best-in-class steady-state and transient analyses. The solution provides detailed insight into the product behavior under a variety of manufacturing, shipping and operating conditions. Don’t forget to subscribe: https://goo.gl/bDS7oS Dassault Systemes official website: http://www.3ds.com/ Follow us! Facebook: https://www.facebook.com/DassaultSystemes Twitter: https://twitter.com/Dassault3DS Linkedin: https://www.linkedin.com/company/dassaultsystemes